IS24C02A-2SLI Integrated Silicon Solution IncBuy Now Datasheet |
34LC02-E/PPart not found Search for 34LC02-E/P |
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | INTEGRATED SILICON SOLUTION INC | |
| Part Package Code | TSSOP | |
| Package Description | TSSOP, TSSOP8,.19 | |
| Pin Count | 8 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Clock Frequency-Max (fCLK) | 1 MHz | |
| Data Retention Time-Min | 100 | |
| Endurance | 1000000 Write/Erase Cycles | |
| I2C Control Byte | 1010DDDR | |
| JESD-30 Code | S-PDSO-G8 | |
| JESD-609 Code | e3 | |
| Length | 3 mm | |
| Memory Density | 2048 bit | |
| Memory IC Type | EEPROM | |
| Memory Width | 8 | |
| Moisture Sensitivity Level | 1 | |
| Number of Functions | 1 | |
| Number of Terminals | 8 | |
| Number of Words | 256 words | |
| Number of Words Code | 256 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 256X8 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TSSOP | |
| Package Equivalence Code | TSSOP8,.19 | |
| Package Shape | SQUARE | |
| Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
| Parallel/Serial | SERIAL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Power Supplies | 2/5 V | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.1 mm | |
| Serial Bus Type | I2C | |
| Standby Current-Max | 0.000001 A | |
| Supply Current-Max | 0.003 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 1.8 V | |
| Supply Voltage-Nom (Vsup) | 2.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.65 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | 10 | |
| Width | 3 mm | |
| Write Cycle Time-Max (tWC) | 5 ms | |
| Write Protection | HARDWARE | |
| Base Number Matches | 1 | |