IS25LP016D-JGLA1 vs MX25L1606EMI-12G feature comparison

IS25LP016D-JGLA1 Integrated Silicon Solution Inc

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MX25L1606EMI-12G Macronix International Co Ltd

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer INTEGRATED SILICON SOLUTION INC MACRONIX INTERNATIONAL CO LTD
Package Description TBGA, SOP, SOP16,.4
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Clock Frequency-Max (fCLK) 133 MHz 86 MHz
JESD-30 Code R-PBGA-B24 R-PDSO-G16
Length 8 mm 10.3 mm
Memory Density 16777216 bit 16777216 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 24 16
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 2MX8 2MX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TBGA SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE SMALL OUTLINE
Parallel/Serial SERIAL SERIAL
Programming Voltage 3 V 3 V
Screening Level AEC-Q100
Seated Height-Max 1.2 mm 2.65 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.3 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form BALL GULL WING
Terminal Pitch 1 mm 1.27 mm
Terminal Position BOTTOM DUAL
Width 6 mm 7.52 mm
Base Number Matches 1 1
Rohs Code Yes
Part Package Code SOIC
Pin Count 16
Factory Lead Time 10 Weeks
Alternate Memory Width 1
Data Retention Time-Min 20
Endurance 100000 Write/Erase Cycles
Package Equivalence Code SOP16,.4
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified
Serial Bus Type SPI
Standby Current-Max 0.00002 A
Supply Current-Max 0.025 mA
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Type NOR TYPE
Write Protection HARDWARE/SOFTWARE

Compare IS25LP016D-JGLA1 with alternatives

Compare MX25L1606EMI-12G with alternatives