ISD33060E
vs
ISD1612BXYI01
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
WINBOND ELECTRONICS CORP
|
WINBOND ELECTRONICS CORP
|
Part Package Code |
TSOP
|
DIE
|
Package Description |
8 X 13.40 MM, PLASTIC, TSOP1-28
|
DIE,
|
Pin Count |
28
|
16
|
Reach Compliance Code |
not_compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Consumer IC Type |
SPEECH SYNTHESIZER WITH RCDG
|
SPEECH SYNTHESIZER WITH RCDG
|
JESD-30 Code |
R-PDSO-G28
|
R-XUUC-N16
|
JESD-609 Code |
e0
|
|
Length |
11.8 mm
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
28
|
16
|
On Chip Memory Type |
EEPROM
|
FLASH
|
Operating Temperature-Max |
70 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
Package Code |
TSOP1
|
DIE
|
Package Equivalence Code |
TSSOP28,.53,22
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE
|
UNCASED CHIP
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Reading Time-Max |
62.3 s
|
24 s
|
Seated Height-Max |
1.2 mm
|
|
Supply Current-Max |
40 mA
|
|
Supply Voltage-Max (Vsup) |
3.3 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
2.7 V
|
2.4 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
|
Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
GULL WING
|
NO LEAD
|
Terminal Pitch |
0.55 mm
|
|
Terminal Position |
DUAL
|
UPPER
|
Width |
8 mm
|
|
Base Number Matches |
2
|
1
|
Pbfree Code |
|
Yes
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare ISD33060E with alternatives
Compare ISD1612BXYI01 with alternatives