ISD33060ED vs I1790PYIR01 feature comparison

ISD33060ED Nuvoton Technology Corp

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I1790PYIR01 Winbond Electronics Corp

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INFORMATION STORAGE DEVICES WINBOND ELECTRONICS CORP
Package Description TSSOP, TSSOP28,.53,22 DIP,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Consumer IC Type SPEECH SYNTHESIZER WITH RCDG SPEECH SYNTHESIZER WITH RCDG
JESD-30 Code R-PDSO-G28 R-PDIP-T28
JESD-609 Code e0 e3
Number of Functions 1 1
Number of Terminals 28 28
On Chip Memory Type EEPROM FLASH
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP DIP
Package Equivalence Code TSSOP28,.53,22 DIP28,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Qualification Status Not Qualified Not Qualified
Reading Time-Max 64.6 s 180 s
Supply Current-Max 40 mA
Supply Voltage-Max (Vsup) 3.3 V 5.5 V
Supply Voltage-Min (Vsup) 2.7 V 2.4 V
Surface Mount YES NO
Technology CMOS
Terminal Finish TIN LEAD MATTE TIN
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.55 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 2 1
Part Package Code DIP
Pin Count 28
Length 36.83 mm
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Seated Height-Max 4.83 mm
Temperature Grade INDUSTRIAL
Width 15.24 mm

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Compare I1790PYIR01 with alternatives