ISD33060PD
vs
ISD5108SYI
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
WINBOND ELECTRONICS CORP
|
WINBOND ELECTRONICS CORP
|
| Part Package Code |
DIP
|
SOIC
|
| Package Description |
0.600 INCH, PLASTIC, DIP-28
|
SOP, SOP28,.4
|
| Pin Count |
28
|
28
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Consumer IC Type |
SPEECH SYNTHESIZER WITH RCDG
|
SPEECH SYNTHESIZER WITH RCDG
|
| JESD-30 Code |
R-PDIP-T28
|
R-PDSO-G28
|
| JESD-609 Code |
e0
|
|
| Length |
36.83 mm
|
17.93 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
28
|
28
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
-20 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
SOP
|
| Package Equivalence Code |
DIP28,.6
|
SOP28,.4
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Reading Time-Max |
62.9 s
|
480 s
|
| Seated Height-Max |
4.83 mm
|
2.64 mm
|
| Supply Current-Max |
40 mA
|
40 mA
|
| Supply Voltage-Max (Vsup) |
3.3 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
15.24 mm
|
7.52 mm
|
| Base Number Matches |
2
|
2
|
| Application |
|
ANSWERING MACHINE
|
| On Chip Memory Type |
|
FLASH
|
|
|
|
Compare ISD33060PD with alternatives
Compare ISD5108SYI with alternatives