ISD33060PI vs I1740XYIR01 feature comparison

ISD33060PI Nuvoton Technology Corp

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I1740XYIR01 Winbond Electronics Corp

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INFORMATION STORAGE DEVICES WINBOND ELECTRONICS CORP
Package Description DIP, DIP28,.6 DIE,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Consumer IC Type SPEECH SYNTHESIZER WITH RCDG SPEECH SYNTHESIZER WITH RCDG
JESD-30 Code R-PDIP-T28 X-XUUC-N
JESD-609 Code e0
Number of Terminals 28
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code DIP DIE
Package Equivalence Code DIP28,.6
Package Shape RECTANGULAR UNSPECIFIED
Package Style IN-LINE UNCASED CHIP
Qualification Status Not Qualified Not Qualified
Reading Time-Max 64.6 s 80 s
Supply Current-Max 40 mA
Surface Mount NO YES
Technology CMOS
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE NO LEAD
Terminal Pitch 2.54 mm
Terminal Position DUAL UPPER
Base Number Matches 1 1
Part Package Code DIE
Number of Functions 1
On Chip Memory Type FLASH
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 2.4 V
Temperature Grade INDUSTRIAL

Compare ISD33060PI with alternatives

Compare I1740XYIR01 with alternatives