ISD33060PI
vs
ISD4002-120ZI
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
WINBOND ELECTRONICS CORP
|
WINBOND ELECTRONICS CORP
|
| Part Package Code |
DIP
|
BGA
|
| Package Description |
0.600 INCH, PLASTIC, DIP-28
|
VFBGA, BGA19,4X5,30
|
| Pin Count |
28
|
19
|
| Reach Compliance Code |
not_compliant
|
not_compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Consumer IC Type |
SPEECH SYNTHESIZER WITH RCDG
|
SPEECH SYNTHESIZER WITH RCDG
|
| JESD-30 Code |
R-PDIP-T28
|
R-PBGA-B19
|
| JESD-609 Code |
e0
|
e0
|
| Length |
36.83 mm
|
6.1 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
28
|
19
|
| On Chip Memory Type |
EEPROM
|
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
VFBGA
|
| Package Equivalence Code |
DIP28,.6
|
BGA19,4X5,30
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Reading Time-Max |
64.8 s
|
120 s
|
| Seated Height-Max |
4.83 mm
|
0.85 mm
|
| Supply Current-Max |
40 mA
|
40 mA
|
| Supply Voltage-Max (Vsup) |
3.3 V
|
3.3 V
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
BALL
|
| Terminal Pitch |
2.54 mm
|
0.75 mm
|
| Terminal Position |
DUAL
|
BOTTOM
|
| Width |
15.24 mm
|
4.7 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare ISD33060PI with alternatives
Compare ISD4002-120ZI with alternatives