ISD33060PI vs I1740SY01 feature comparison

ISD33060PI Nuvoton Technology Corp

Buy Now Datasheet

I1740SY01 Winbond Electronics Corp

Buy Now Datasheet
Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INFORMATION STORAGE DEVICES WINBOND ELECTRONICS CORP
Package Description DIP, DIP28,.6 SOP,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Consumer IC Type SPEECH SYNTHESIZER WITH RCDG SPEECH SYNTHESIZER WITH RCDG
JESD-30 Code R-PDIP-T28 R-PDSO-G28
JESD-609 Code e0 e3
Number of Functions 1 1
Number of Terminals 28 28
On Chip Memory Type EEPROM FLASH
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP28,.6 SOP28,.4
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Reading Time-Max 64.6 s 80 s
Supply Current-Max 40 mA
Supply Voltage-Max (Vsup) 3.3 V 5.5 V
Supply Voltage-Min (Vsup) 2.7 V 2.4 V
Surface Mount NO YES
Technology CMOS
Terminal Finish TIN LEAD MATTE TIN
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Base Number Matches 2 1
Part Package Code SOIC
Pin Count 28
Length 17.93 mm
Operating Temperature-Max 70 °C
Operating Temperature-Min
Seated Height-Max 2.64 mm
Temperature Grade COMMERCIAL
Width 7.52 mm

Compare ISD33060PI with alternatives

Compare I1740SY01 with alternatives