ISD4003-04MXI vs ISD4003-04MXY feature comparison

ISD4003-04MXI Nuvoton Technology Corp

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ISD4003-04MXY Winbond Electronics Corp

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Part Life Cycle Code Active Transferred
Ihs Manufacturer NUVOTON TECHNOLOGY CORP WINBOND ELECTRONICS CORP
Part Package Code DIE DIE
Package Description DIE, DIE,
Pin Count 19 19
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Consumer IC Type SPEECH SYNTHESIZER WITH RCDG SPEECH SYNTHESIZER WITH RCDG
JESD-30 Code R-XUUC-N19 R-XUUC-N19
Number of Functions 1 1
Number of Terminals 19 19
On Chip Memory Type FLASH FLASH
Operating Temperature-Max 85 °C 50 °C
Operating Temperature-Min -40 °C
Package Body Material UNSPECIFIED UNSPECIFIED
Package Code DIE DIE
Package Shape RECTANGULAR RECTANGULAR
Package Style UNCASED CHIP UNCASED CHIP
Qualification Status Not Qualified Not Qualified
Reading Time-Max 240 s 240 s
Supply Voltage-Max (Vsup) 3.3 V 3.3 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form NO LEAD NO LEAD
Terminal Position UPPER UPPER
Base Number Matches 1 3

Compare ISD4003-04MXI with alternatives

Compare ISD4003-04MXY with alternatives