ISD4003-06MPI vs ISD4003-06MXYD feature comparison

ISD4003-06MPI Nuvoton Technology Corp

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ISD4003-06MXYD Winbond Electronics Corp

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NUVOTON TECHNOLOGY CORP WINBOND ELECTRONICS CORP
Part Package Code DIP DIE
Package Description DIP, DIE,
Pin Count 28 19
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Consumer IC Type SPEECH SYNTHESIZER WITH RCDG SPEECH SYNTHESIZER WITH RCDG
JESD-30 Code R-PDIP-T28 R-XUUC-N19
Length 36.83 mm
Number of Functions 1 1
Number of Terminals 28 19
On Chip Memory Type FLASH FLASH
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C -20 °C
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code DIP DIE
Package Equivalence Code DIP28,.6 DIE OR CHIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE UNCASED CHIP
Qualification Status Not Qualified Not Qualified
Reading Time-Max 360 s 360 s
Seated Height-Max 4.83 mm
Supply Voltage-Max (Vsup) 3.3 V 3.3 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form THROUGH-HOLE NO LEAD
Terminal Pitch 2.54 mm
Terminal Position DUAL UPPER
Width 15.24 mm
Base Number Matches 2 2

Compare ISD4003-06MPI with alternatives

Compare ISD4003-06MXYD with alternatives