ISD4003-06MSYI vs ISD4002-120ZI feature comparison

ISD4003-06MSYI Nuvoton Technology Corp

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ISD4002-120ZI Winbond Electronics Corp

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Part Life Cycle Code Active Transferred
Ihs Manufacturer NUVOTON TECHNOLOGY CORP WINBOND ELECTRONICS CORP
Part Package Code SOIC BGA
Package Description SOP, SOP28,.4 VFBGA, BGA19,4X5,30
Pin Count 28 19
Reach Compliance Code compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Consumer IC Type SPEECH SYNTHESIZER WITH RCDG SPEECH SYNTHESIZER WITH RCDG
JESD-30 Code R-PDSO-G28 R-PBGA-B19
Length 17.93 mm 6.1 mm
Number of Functions 1 1
Number of Terminals 28 19
On Chip Memory Type FLASH
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP VFBGA
Package Equivalence Code SOP28,.4 BGA19,4X5,30
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
Reading Time-Max 360 s 120 s
Seated Height-Max 2.64 mm 0.85 mm
Supply Current-Max 40 mA 40 mA
Supply Voltage-Max (Vsup) 3.3 V 3.3 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING BALL
Terminal Pitch 1.27 mm 0.75 mm
Terminal Position DUAL BOTTOM
Width 7.52 mm 4.7 mm
Base Number Matches 2 2
Rohs Code No
JESD-609 Code e0
Terminal Finish TIN LEAD

Compare ISD4003-06MSYI with alternatives

Compare ISD4002-120ZI with alternatives