ISD4003-06MXYD
vs
ISD4002-120ZI
feature comparison
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
WINBOND ELECTRONICS CORP
|
WINBOND ELECTRONICS CORP
|
Part Package Code |
DIE
|
BGA
|
Package Description |
DIE,
|
VFBGA, BGA19,4X5,30
|
Pin Count |
19
|
19
|
Reach Compliance Code |
unknown
|
not_compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Consumer IC Type |
SPEECH SYNTHESIZER WITH RCDG
|
SPEECH SYNTHESIZER WITH RCDG
|
JESD-30 Code |
R-XUUC-N19
|
R-PBGA-B19
|
Number of Functions |
1
|
1
|
Number of Terminals |
19
|
19
|
On Chip Memory Type |
FLASH
|
|
Operating Temperature-Max |
70 °C
|
85 °C
|
Operating Temperature-Min |
-20 °C
|
-40 °C
|
Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
Package Code |
DIE
|
VFBGA
|
Package Equivalence Code |
DIE OR CHIP
|
BGA19,4X5,30
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
UNCASED CHIP
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Reading Time-Max |
360 s
|
120 s
|
Supply Voltage-Max (Vsup) |
3.3 V
|
3.3 V
|
Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
Terminal Form |
NO LEAD
|
BALL
|
Terminal Position |
UPPER
|
BOTTOM
|
Base Number Matches |
1
|
1
|
Rohs Code |
|
No
|
JESD-609 Code |
|
e0
|
Length |
|
6.1 mm
|
Seated Height-Max |
|
0.85 mm
|
Supply Current-Max |
|
40 mA
|
Terminal Finish |
|
TIN LEAD
|
Terminal Pitch |
|
0.75 mm
|
Width |
|
4.7 mm
|
|
|
|
Compare ISD4003-06MXYD with alternatives
Compare ISD4002-120ZI with alternatives