ISD5008X vs I1790PYIR01 feature comparison

ISD5008X Winbond Electronics Corp

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I1790PYIR01 Winbond Electronics Corp

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer WINBOND ELECTRONICS CORP WINBOND ELECTRONICS CORP
Part Package Code DIE DIP
Package Description DIE, DIP,
Pin Count 25 28
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Application CELLULAR PHONE; PORTABLE APPLIANCES
Consumer IC Type SPEECH SYNTHESIZER WITH RCDG SPEECH SYNTHESIZER WITH RCDG
JESD-30 Code R-XUUC-N25 R-PDIP-T28
JESD-609 Code e0 e3
Number of Functions 1 1
Number of Terminals 25 28
On Chip Memory Type FLASH FLASH
Operating Temperature-Max 50 °C 85 °C
Operating Temperature-Min -40 °C
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Code DIE DIP
Package Equivalence Code DIE OR CHIP DIP28,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style UNCASED CHIP IN-LINE
Qualification Status Not Qualified Not Qualified
Reading Time-Max 480 s 180 s
Supply Voltage-Max (Vsup) 3.3 V 5.5 V
Supply Voltage-Min (Vsup) 2.7 V 2.4 V
Surface Mount YES NO
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD MATTE TIN
Terminal Form NO LEAD THROUGH-HOLE
Terminal Position UPPER DUAL
Base Number Matches 2 1
Length 36.83 mm
Seated Height-Max 4.83 mm
Terminal Pitch 2.54 mm
Width 15.24 mm

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Compare I1790PYIR01 with alternatives