ISD5008X
vs
I1790SYI01
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
WINBOND ELECTRONICS CORP
|
WINBOND ELECTRONICS CORP
|
Part Package Code |
DIE
|
SOIC
|
Package Description |
DIE,
|
SOP,
|
Pin Count |
25
|
28
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Application |
CELLULAR PHONE; PORTABLE APPLIANCES
|
|
Consumer IC Type |
SPEECH SYNTHESIZER WITH RCDG
|
SPEECH SYNTHESIZER WITH RCDG
|
JESD-30 Code |
R-XUUC-N25
|
R-PDSO-G28
|
JESD-609 Code |
e0
|
e3
|
Number of Functions |
1
|
1
|
Number of Terminals |
25
|
28
|
On Chip Memory Type |
FLASH
|
FLASH
|
Operating Temperature-Max |
50 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
Package Code |
DIE
|
SOP
|
Package Equivalence Code |
DIE OR CHIP
|
SOP28,.4
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
UNCASED CHIP
|
SMALL OUTLINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Reading Time-Max |
480 s
|
180 s
|
Supply Voltage-Max (Vsup) |
3.3 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
2.7 V
|
2.4 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN LEAD
|
MATTE TIN
|
Terminal Form |
NO LEAD
|
GULL WING
|
Terminal Position |
UPPER
|
DUAL
|
Base Number Matches |
2
|
1
|
Length |
|
17.93 mm
|
Seated Height-Max |
|
2.64 mm
|
Terminal Pitch |
|
1.27 mm
|
Width |
|
7.52 mm
|
|
|
|
Compare ISD5008X with alternatives
Compare I1790SYI01 with alternatives