ISD5008X vs ISD1612BXYI01 feature comparison

ISD5008X Nuvoton Technology Corp

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ISD1612BXYI01 Winbond Electronics Corp

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer INFORMATION STORAGE DEVICES WINBOND ELECTRONICS CORP
Part Package Code DIE DIE
Package Description DIE, DIE,
Pin Count 25 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Consumer IC Type SPEECH SYNTHESIZER WITH RCDG SPEECH SYNTHESIZER WITH RCDG
JESD-30 Code R-XUUC-N25 R-XUUC-N16
Number of Terminals 25 16
Package Body Material UNSPECIFIED UNSPECIFIED
Package Code DIE DIE
Package Shape RECTANGULAR RECTANGULAR
Package Style UNCASED CHIP UNCASED CHIP
Qualification Status Not Qualified Not Qualified
Surface Mount YES YES
Terminal Form NO LEAD NO LEAD
Terminal Position UPPER UPPER
Base Number Matches 2 1
Pbfree Code Yes
Rohs Code Yes
Number of Functions 1
On Chip Memory Type FLASH
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Reading Time-Max 24 s
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 2.4 V
Temperature Grade INDUSTRIAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare ISD5008X with alternatives

Compare ISD1612BXYI01 with alternatives