ISD5008X
vs
ISD4003-04MXY
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
WINBOND ELECTRONICS CORP
|
NUVOTON TECHNOLOGY CORP
|
Part Package Code |
DIE
|
DIE
|
Package Description |
DIE,
|
DIE,
|
Pin Count |
25
|
19
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Application |
CELLULAR PHONE; PORTABLE APPLIANCES
|
|
Consumer IC Type |
SPEECH SYNTHESIZER WITH RCDG
|
SPEECH SYNTHESIZER WITH RCDG
|
JESD-30 Code |
R-XUUC-N25
|
R-XUUC-N19
|
JESD-609 Code |
e0
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
25
|
19
|
On Chip Memory Type |
FLASH
|
FLASH
|
Operating Temperature-Max |
50 °C
|
50 °C
|
Operating Temperature-Min |
|
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Code |
DIE
|
DIE
|
Package Equivalence Code |
DIE OR CHIP
|
DIE OR CHIP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
UNCASED CHIP
|
UNCASED CHIP
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Reading Time-Max |
480 s
|
240 s
|
Supply Voltage-Max (Vsup) |
3.3 V
|
3.3 V
|
Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Position |
UPPER
|
UPPER
|
Base Number Matches |
2
|
2
|
Technology |
|
CMOS
|
|
|
|
Compare ISD5008X with alternatives
Compare ISD4003-04MXY with alternatives