ISDMICROTAD-16MP vs I1740SY01 feature comparison

ISDMICROTAD-16MP Winbond Electronics Corp

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I1740SY01 Winbond Electronics Corp

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer WINBOND ELECTRONICS CORP WINBOND ELECTRONICS CORP
Part Package Code DIP SOIC
Package Description 0.600 INCH, PLASTIC, DIP-28 SOP,
Pin Count 28 28
Reach Compliance Code not_compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Consumer IC Type SPEECH SYNTHESIZER WITH RCDG SPEECH SYNTHESIZER WITH RCDG
JESD-30 Code R-PDIP-T28 R-PDSO-G28
JESD-609 Code e0 e3
Length 36.83 mm 17.93 mm
Number of Functions 1 1
Number of Terminals 28 28
Operating Temperature-Max 50 °C 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP28,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.83 mm 2.64 mm
Supply Current-Max 40 mA
Supply Voltage-Max (Vsup) 3.15 V 5.5 V
Supply Voltage-Min (Vsup) 2.85 V 2.4 V
Surface Mount NO YES
Technology CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD MATTE TIN
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Width 15.24 mm 7.52 mm
Base Number Matches 2 1
On Chip Memory Type FLASH
Reading Time-Max 80 s

Compare ISDMICROTAD-16MP with alternatives

Compare I1740SY01 with alternatives