ISDMICROTAD-16MP vs ISD1612BXYI01 feature comparison

ISDMICROTAD-16MP Nuvoton Technology Corp

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ISD1612BXYI01 Winbond Electronics Corp

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer INFORMATION STORAGE DEVICES WINBOND ELECTRONICS CORP
Part Package Code DIP DIE
Package Description , DIE,
Pin Count 28 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Application ANSWERING MACHINE
Consumer IC Type SPEECH SYNTHESIZER WITH RCDG SPEECH SYNTHESIZER WITH RCDG
JESD-30 Code R-PDIP-T28 R-XUUC-N16
Number of Functions 1 1
Number of Terminals 28 16
Operating Temperature-Max 50 °C 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE UNCASED CHIP
Qualification Status Not Qualified Not Qualified
Reading Time-Max 960 s 24 s
Supply Voltage-Max (Vsup) 3.15 V 5.5 V
Supply Voltage-Min (Vsup) 2.85 V 2.4 V
Surface Mount NO YES
Technology CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form THROUGH-HOLE NO LEAD
Terminal Position DUAL UPPER
Base Number Matches 2 1
Pbfree Code Yes
Rohs Code Yes
On Chip Memory Type FLASH
Package Code DIE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare ISDMICROTAD-16MP with alternatives

Compare ISD1612BXYI01 with alternatives