ISDMICROTAD-16MP vs ISD4002-120ZI feature comparison

ISDMICROTAD-16MP Nuvoton Technology Corp

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ISD4002-120ZI Winbond Electronics Corp

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer INFORMATION STORAGE DEVICES WINBOND ELECTRONICS CORP
Part Package Code DIP BGA
Package Description , VFBGA, BGA19,4X5,30
Pin Count 28 19
Reach Compliance Code unknown not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Application ANSWERING MACHINE
Consumer IC Type SPEECH SYNTHESIZER WITH RCDG SPEECH SYNTHESIZER WITH RCDG
JESD-30 Code R-PDIP-T28 R-PBGA-B19
Number of Functions 1 1
Number of Terminals 28 19
Operating Temperature-Max 50 °C 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP VFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
Reading Time-Max 960 s 120 s
Supply Voltage-Max (Vsup) 3.15 V 3.3 V
Supply Voltage-Min (Vsup) 2.85 V 2.7 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form THROUGH-HOLE BALL
Terminal Position DUAL BOTTOM
Base Number Matches 2 2
Rohs Code No
JESD-609 Code e0
Length 6.1 mm
Package Equivalence Code BGA19,4X5,30
Seated Height-Max 0.85 mm
Supply Current-Max 40 mA
Terminal Finish TIN LEAD
Terminal Pitch 0.75 mm
Width 4.7 mm

Compare ISDMICROTAD-16MP with alternatives

Compare ISD4002-120ZI with alternatives