ISDMICROTAD-16MP vs ISD4003-06MXYD feature comparison

ISDMICROTAD-16MP Nuvoton Technology Corp

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ISD4003-06MXYD Winbond Electronics Corp

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer INFORMATION STORAGE DEVICES WINBOND ELECTRONICS CORP
Part Package Code DIP DIE
Package Description , DIE,
Pin Count 28 19
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Application ANSWERING MACHINE
Consumer IC Type SPEECH SYNTHESIZER WITH RCDG SPEECH SYNTHESIZER WITH RCDG
JESD-30 Code R-PDIP-T28 R-XUUC-N19
Number of Functions 1 1
Number of Terminals 28 19
Operating Temperature-Max 50 °C 70 °C
Operating Temperature-Min -20 °C
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code DIP DIE
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE UNCASED CHIP
Qualification Status Not Qualified Not Qualified
Reading Time-Max 960 s 360 s
Supply Voltage-Max (Vsup) 3.15 V 3.3 V
Supply Voltage-Min (Vsup) 2.85 V 2.7 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form THROUGH-HOLE NO LEAD
Terminal Position DUAL UPPER
Base Number Matches 2 2
On Chip Memory Type FLASH
Package Equivalence Code DIE OR CHIP

Compare ISDMICROTAD-16MP with alternatives

Compare ISD4003-06MXYD with alternatives