ISDMICROTAD-16MS vs I1790PYIR01 feature comparison

ISDMICROTAD-16MS Winbond Electronics Corp

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I1790PYIR01 Winbond Electronics Corp

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer WINBOND ELECTRONICS CORP WINBOND ELECTRONICS CORP
Part Package Code SOIC DIP
Package Description 0.300 INCH, PLASTIC, SOIC-28 DIP,
Pin Count 28 28
Reach Compliance Code not_compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Consumer IC Type SPEECH SYNTHESIZER WITH RCDG SPEECH SYNTHESIZER WITH RCDG
JESD-30 Code R-PDSO-G28 R-PDIP-T28
JESD-609 Code e0 e3
Length 17.9 mm 36.83 mm
Number of Functions 1 1
Number of Terminals 28 28
Operating Temperature-Max 50 °C 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP DIP
Package Equivalence Code SOP28,.4
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.65 mm 4.83 mm
Supply Current-Max 40 mA
Supply Voltage-Max (Vsup) 3.15 V 5.5 V
Supply Voltage-Min (Vsup) 2.85 V 2.4 V
Surface Mount YES NO
Technology CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD MATTE TIN
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.5 mm 15.24 mm
Base Number Matches 2 1
On Chip Memory Type FLASH
Reading Time-Max 180 s

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Compare I1790PYIR01 with alternatives