ISDMICROTAD-16MS vs ISD1612BXYI01 feature comparison

ISDMICROTAD-16MS Winbond Electronics Corp

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ISD1612BXYI01 Winbond Electronics Corp

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer WINBOND ELECTRONICS CORP WINBOND ELECTRONICS CORP
Part Package Code SOIC DIE
Package Description 0.300 INCH, PLASTIC, SOIC-28 DIE,
Pin Count 28 16
Reach Compliance Code not_compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Consumer IC Type SPEECH SYNTHESIZER WITH RCDG SPEECH SYNTHESIZER WITH RCDG
JESD-30 Code R-PDSO-G28 R-XUUC-N16
JESD-609 Code e0
Length 17.9 mm
Number of Functions 1 1
Number of Terminals 28 16
On Chip Memory Type FLASH FLASH
Operating Temperature-Max 50 °C 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code SOP DIE
Package Equivalence Code SOP28,.4
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE UNCASED CHIP
Qualification Status Not Qualified Not Qualified
Reading Time-Max 960 s 24 s
Seated Height-Max 2.65 mm
Supply Current-Max 40 mA
Supply Voltage-Max (Vsup) 3.15 V 5.5 V
Supply Voltage-Min (Vsup) 2.85 V 2.4 V
Surface Mount YES YES
Technology CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form GULL WING NO LEAD
Terminal Pitch 1.27 mm
Terminal Position DUAL UPPER
Width 7.5 mm
Base Number Matches 2 1
Pbfree Code Yes
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare ISDMICROTAD-16MS with alternatives

Compare ISD1612BXYI01 with alternatives