ISDMICROTAD-16MS vs ISD4002-120ZI feature comparison

ISDMICROTAD-16MS Winbond Electronics Corp

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ISD4002-120ZI Winbond Electronics Corp

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Rohs Code No No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer WINBOND ELECTRONICS CORP WINBOND ELECTRONICS CORP
Part Package Code SOIC BGA
Package Description 0.300 INCH, PLASTIC, SOIC-28 VFBGA, BGA19,4X5,30
Pin Count 28 19
Reach Compliance Code not_compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Consumer IC Type SPEECH SYNTHESIZER WITH RCDG SPEECH SYNTHESIZER WITH RCDG
JESD-30 Code R-PDSO-G28 R-PBGA-B19
JESD-609 Code e0 e0
Length 17.9 mm 6.1 mm
Number of Functions 1 1
Number of Terminals 28 19
Operating Temperature-Max 50 °C 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP VFBGA
Package Equivalence Code SOP28,.4 BGA19,4X5,30
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.65 mm 0.85 mm
Supply Current-Max 40 mA 40 mA
Supply Voltage-Max (Vsup) 3.15 V 3.3 V
Supply Voltage-Min (Vsup) 2.85 V 2.7 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form GULL WING BALL
Terminal Pitch 1.27 mm 0.75 mm
Terminal Position DUAL BOTTOM
Width 7.5 mm 4.7 mm
Base Number Matches 2 2
Reading Time-Max 120 s

Compare ISDMICROTAD-16MS with alternatives

Compare ISD4002-120ZI with alternatives