ISL28233IUZ
vs
ISL28233FUZ-T7A
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
INTERSIL CORP
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Architecture |
CHOPPER-STAB
|
CHOPPER-STAB
|
| Average Bias Current-Max (IIB) |
0.00011 µA
|
0.0006 µA
|
| Bias Current-Max (IIB) @25C |
0.00011 µA
|
|
| Common-mode Reject Ratio-Min |
118 dB
|
|
| Common-mode Reject Ratio-Nom |
125 dB
|
125 dB
|
| Frequency Compensation |
NO
|
YES
|
| Input Offset Voltage-Max |
11.9 µV
|
11 µV
|
| JESD-30 Code |
S-PDSO-G8
|
S-PDSO-G8
|
| Length |
3 mm
|
3 mm
|
| Low-Bias |
YES
|
YES
|
| Low-Offset |
YES
|
YES
|
| Micropower |
YES
|
YES
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
TSSOP
|
| Package Equivalence Code |
TSSOP8,.19
|
TSSOP8,.19
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE
|
| Programmable Power |
NO
|
|
| Seated Height-Max |
1.1 mm
|
1.1 mm
|
| Supply Current-Max |
0.07 mA
|
0.07 mA
|
| Supply Voltage Limit-Max |
6.5 V
|
6.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Unity Gain BW-Nom |
400
|
400
|
| Wideband |
NO
|
|
| Width |
3 mm
|
3 mm
|
| Base Number Matches |
3
|
2
|
| Part Package Code |
|
DFN, MSOP, SOIC
|
| Package Description |
|
TSSOP, TSSOP8,.19
|
| Pin Count |
|
8, 8, 8
|
| Factory Lead Time |
|
26 Weeks
|
| JESD-609 Code |
|
e3
|
| Moisture Sensitivity Level |
|
2
|
| Packing Method |
|
TAPE AND REEL
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Qualification Status |
|
Not Qualified
|
| Slew Rate-Nom |
|
0.2 V/us
|
| Technology |
|
CMOS
|
| Terminal Finish |
|
MATTE TIN
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
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