ISL28258FBZ
vs
ISL28258FUZ-T7
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
INTERSIL CORP
|
| Package Description |
SOP, SOP8,.23
|
ROHS COMPLIANT, MSOP-8
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Date Of Intro |
2017-11-07
|
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Architecture |
VOLTAGE-FEEDBACK
|
VOLTAGE-FEEDBACK
|
| Average Bias Current-Max (IIB) |
0.00008 µA
|
0.00008 µA
|
| Bandwidth (3dB)-Nom |
0.42 MHz
|
|
| Common-mode Reject Ratio-Min |
75 dB
|
|
| Common-mode Reject Ratio-Nom |
98 dB
|
98 dB
|
| Frequency Compensation |
NO
|
YES
|
| Input Offset Voltage-Max |
650 µV
|
650 µV
|
| JESD-30 Code |
R-PDSO-G8
|
S-PDSO-G8
|
| Length |
4.9 mm
|
3 mm
|
| Low-Bias |
NO
|
YES
|
| Low-Offset |
YES
|
YES
|
| Micropower |
NO
|
YES
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
TSSOP
|
| Package Equivalence Code |
SOP8,.23
|
TSSOP8,.25
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUT LINE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Power |
NO
|
NO
|
| Programmable Power |
NO
|
NO
|
| Seated Height-Max |
1.75 mm
|
1.1 mm
|
| Slew Rate-Nom |
0.1 V/us
|
0.1 V/us
|
| Supply Voltage Limit-Max |
5.75 V
|
5.75 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Unity Gain BW-Nom |
200
|
200
|
| Voltage Gain-Min |
0.075
|
75000
|
| Wideband |
NO
|
NO
|
| Width |
3.9 mm
|
3 mm
|
| Base Number Matches |
2
|
2
|
| Part Package Code |
|
MSOP, SOIC
|
| Pin Count |
|
8, 8
|
| Bias Current-Max (IIB) @25C |
|
0.00003 µA
|
| JESD-609 Code |
|
e3
|
| Moisture Sensitivity Level |
|
2
|
| Neg Supply Voltage Limit-Max |
|
|
| Neg Supply Voltage-Nom (Vsup) |
|
|
| Packing Method |
|
TAPE AND REEL
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Qualification Status |
|
Not Qualified
|
| Supply Current-Max |
|
0.11 mA
|
| Terminal Finish |
|
MATTE TIN
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
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