ISL55210IRTZ-T7A
vs
ISL55211IRTZ
feature comparison
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
INTERSIL CORP
|
INTERSIL CORP
|
Part Package Code |
TQFN
|
TQFN
|
Package Description |
HVQCCN, LCC16,.12SQ,20
|
HVQCCN, LCC16,.12SQ,20
|
Pin Count |
16
|
16
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.33.00.01
|
8542.33.00.01
|
Factory Lead Time |
78 Weeks
|
|
Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
Average Bias Current-Max (IIB) |
140 µA
|
140 µA
|
Common-mode Reject Ratio-Nom |
75 dB
|
75 dB
|
Input Offset Voltage-Max |
1600 µV
|
1600 µV
|
JESD-30 Code |
S-PQCC-N16
|
S-PQCC-N16
|
JESD-609 Code |
e3
|
e3
|
Length |
3 mm
|
3 mm
|
Moisture Sensitivity Level |
2
|
2
|
Number of Functions |
1
|
1
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HVQCCN
|
HVQCCN
|
Package Equivalence Code |
LCC16,.12SQ,20
|
LCC16,.12SQ,20
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
0.8 mm
|
0.8 mm
|
Slew Rate-Nom |
150 V/us
|
5600 V/us
|
Supply Current-Max |
39.5 mA
|
39.5 mA
|
Supply Voltage Limit-Max |
4.5 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
BIPOLAR
|
BIPOLAR
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
MATTE TIN
|
Matte Tin (Sn) - annealed
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Unity Gain BW-Nom |
4000000
|
|
Width |
3 mm
|
3 mm
|
Base Number Matches |
1
|
5
|
|
|
|
Compare ISL55210IRTZ-T7A with alternatives
Compare ISL55211IRTZ with alternatives