ISL6612ACBZ
vs
ISL6612ECB-T
feature comparison
| Pbfree Code |
Yes
|
No
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
INTERSIL CORP
|
| Part Package Code |
SOICN
|
SOIC
|
| Pin Count |
8
|
8
|
| Manufacturer Package Code |
M8.15
|
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Renesas Electronics
|
|
| JESD-609 Code |
e3
|
e0
|
| Moisture Sensitivity Level |
3
|
1
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Terminal Finish |
Matte Tin (Sn) - annealed
|
TIN LEAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Base Number Matches |
4
|
1
|
| Package Description |
|
HLSOP, SOP8,.25
|
| High Side Driver |
|
YES
|
| Interface IC Type |
|
HALF BRIDGE BASED MOSFET DRIVER
|
| JESD-30 Code |
|
R-PDSO-G8
|
| Length |
|
4.89 mm
|
| Number of Functions |
|
1
|
| Number of Terminals |
|
8
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
|
| Output Peak Current Limit-Nom |
|
3 A
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
HLSOP
|
| Package Equivalence Code |
|
SOP8,.25
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
1.68 mm
|
| Supply Voltage-Max |
|
12 V
|
| Supply Voltage-Min |
|
5 V
|
| Supply Voltage1-Max |
|
13.2 V
|
| Supply Voltage1-Min |
|
10.8 V
|
| Supply Voltage1-Nom |
|
12 V
|
| Surface Mount |
|
YES
|
| Temperature Grade |
|
COMMERCIAL EXTENDED
|
| Terminal Form |
|
GULL WING
|
| Terminal Pitch |
|
1.27 mm
|
| Terminal Position |
|
DUAL
|
| Width |
|
3.9 mm
|
|
|
|
Compare ISL6612ACBZ with alternatives
Compare ISL6612ECB-T with alternatives