ISL6614BCB
vs
ISL6614BCRZ-T
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTERSIL CORP
|
INTERSIL CORP
|
| Part Package Code |
SOIC
|
QFN
|
| Package Description |
PLASTIC, MS-012AB, SOIC-14
|
4 X 4 MM, ROHS COMPLIANT, PLASTIC, MO-220VGGC, QFN-16
|
| Pin Count |
14
|
16
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
4 Weeks
|
|
| High Side Driver |
YES
|
YES
|
| Interface IC Type |
HALF BRIDGE BASED MOSFET DRIVER
|
HALF BRIDGE BASED MOSFET DRIVER
|
| JESD-30 Code |
R-PDSO-G14
|
S-PQCC-N16
|
| JESD-609 Code |
e0
|
e3
|
| Length |
8.65 mm
|
4 mm
|
| Moisture Sensitivity Level |
1
|
3
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
14
|
16
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
HVQCCN
|
| Package Equivalence Code |
SOP14,.25
|
LCC16,.16SQ,25
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.75 mm
|
1 mm
|
| Supply Voltage-Max |
13.2 V
|
13.2 V
|
| Supply Voltage-Min |
7 V
|
7 V
|
| Supply Voltage-Nom |
12 V
|
12 V
|
| Supply Voltage1-Max |
12 V
|
12 V
|
| Supply Voltage1-Min |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
OTHER
|
OTHER
|
| Terminal Finish |
TIN LEAD
|
MATTE TIN
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
1.27 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Width |
3.9 mm
|
4 mm
|
| Base Number Matches |
4
|
1
|
| Pbfree Code |
|
Yes
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare ISL6614BCB with alternatives
Compare ISL6614BCRZ-T with alternatives