ISL6700IRZ
vs
ISL6700IR
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
INTERSIL CORP
|
INTERSIL CORP
|
Part Package Code |
DFN
|
DFN
|
Package Description |
4 X 4 MM, PLASTIC, MLFP-12
|
4 X 4 MM, PLASTIC, MLFP-12
|
Pin Count |
12
|
12
|
Manufacturer Package Code |
MLF
|
MLF
|
Reach Compliance Code |
compliant
|
not_compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
4 Weeks
|
4 Weeks
|
High Side Driver |
YES
|
YES
|
Interface IC Type |
HALF BRIDGE BASED MOSFET DRIVER
|
HALF BRIDGE BASED MOSFET DRIVER
|
JESD-30 Code |
S-PQCC-N12
|
S-PQCC-N12
|
JESD-609 Code |
e3
|
e0
|
Length |
4 mm
|
4 mm
|
Moisture Sensitivity Level |
3
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
12
|
12
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Peak Current Limit-Nom |
1.4 A
|
1.4 A
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HVQCCN
|
HVQCCN
|
Package Equivalence Code |
LCC12,.16SQ,32
|
LCC12,.16SQ,32
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1 mm
|
1 mm
|
Supply Voltage-Max |
15 V
|
15 V
|
Supply Voltage-Min |
9 V
|
9 V
|
Supply Voltage-Nom |
12 V
|
12 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Finish |
MATTE TIN
|
TIN LEAD
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
QUAD
|
QUAD
|
Turn-off Time |
0.09 µs
|
0.09 µs
|
Turn-on Time |
0.095 µs
|
0.095 µs
|
Width |
4 mm
|
4 mm
|
Base Number Matches |
2
|
4
|
|
|
|
Compare ISL6700IRZ with alternatives
Compare ISL6700IR with alternatives