ISL9230IRZ
vs
BQ25121AYFPR
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
QFN
|
|
| Package Description |
HVQCCN,
|
VFBGA,
|
| Pin Count |
16
|
|
| Manufacturer Package Code |
L16.3X3E
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Date Of Intro |
2017-11-15
|
2018-05-12
|
| Samacsys Manufacturer |
Renesas Electronics
|
Texas Instruments
|
| Adjustable Threshold |
YES
|
YES
|
| Analog IC - Other Type |
POWER SUPPLY SUPPORT CIRCUIT
|
POWER SUPPLY SUPPORT CIRCUIT
|
| JESD-30 Code |
S-PQCC-N16
|
R-XBGA-B25
|
| JESD-609 Code |
e3
|
e1
|
| Length |
3 mm
|
2.53 mm
|
| Moisture Sensitivity Level |
3
|
1
|
| Number of Channels |
3
|
3
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
25
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
HVQCCN
|
VFBGA
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Seated Height-Max |
1 mm
|
0.5 mm
|
| Supply Voltage-Max (Vsup) |
6.25 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.3 V
|
3.4 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Matte Tin (Sn) - annealed
|
TIN SILVER COPPER
|
| Terminal Form |
NO LEAD
|
BALL
|
| Terminal Pitch |
0.5 mm
|
0.4 mm
|
| Terminal Position |
QUAD
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
3 mm
|
2.468 mm
|
| Base Number Matches |
4
|
1
|
| Rohs Code |
|
Yes
|
| Input Voltage-Max |
|
5.5 V
|
| Input Voltage-Min |
|
3.4 V
|
|
|
|
Compare ISL9230IRZ with alternatives
Compare BQ25121AYFPR with alternatives