ISL98001CQZ-170
vs
X98027L128-3.3-Z
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
INTERSIL CORP
|
INTERSIL CORP
|
| Part Package Code |
MQFP
|
QFP
|
| Package Description |
14 X 20 MM, ROHS COMPLIANT, PLASTIC, MS-022, MQFP-128
|
14 X 20 MM, ROHS COMPLIANT, MS-022, MQFP-128
|
| Pin Count |
128
|
128
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
4 Weeks
|
4 Weeks
|
| Consumer IC Type |
CONSUMER CIRCUIT
|
CONSUMER CIRCUIT
|
| JESD-30 Code |
R-PQFP-G128
|
R-PQFP-G128
|
| JESD-609 Code |
e3
|
e3
|
| Length |
20 mm
|
20 mm
|
| Moisture Sensitivity Level |
2A
|
2A
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
128
|
128
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HFQFP
|
FQFP
|
| Package Equivalence Code |
QFP128,.67X.93,20
|
QFP128,.67X.93,20
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLATPACK, HEAT SINK/SLUG, FINE PITCH
|
FLATPACK, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
3.4 mm
|
3.4 mm
|
| Supply Current-Max |
200 mA
|
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
3.3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
MATTE TIN
|
MATTE TIN
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
14 mm
|
14 mm
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
|
|
|
Compare ISL98001CQZ-170 with alternatives
Compare X98027L128-3.3-Z with alternatives