ISL98003CNZ-165
vs
ISL98003INZ-110
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTERSIL CORP
|
INTERSIL CORP
|
| Part Package Code |
QFP
|
QFP
|
| Package Description |
HTFQFP, QFP80,.55SQ,20
|
HTFQFP, QFP80,.55SQ,20
|
| Pin Count |
80
|
80
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Consumer IC Type |
CONSUMER CIRCUIT
|
CONSUMER CIRCUIT
|
| JESD-30 Code |
S-PQFP-G80
|
S-PQFP-G80
|
| JESD-609 Code |
e3
|
e3
|
| Length |
12 mm
|
12 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
80
|
80
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HTFQFP
|
HTFQFP
|
| Package Equivalence Code |
QFP80,.55SQ,20
|
QFP80,.55SQ,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
|
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.2 mm
|
1.2 mm
|
| Supply Current-Max |
375 mA
|
375 mA
|
| Supply Voltage-Max (Vsup) |
2 V
|
2 V
|
| Supply Voltage-Min (Vsup) |
1.65 V
|
1.65 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
MATTE TIN
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
12 mm
|
12 mm
|
| Base Number Matches |
1
|
1
|
| ECCN Code |
|
EAR99
|
|
|
|
Compare ISL98003CNZ-165 with alternatives
Compare ISL98003INZ-110 with alternatives