ISO102-BI vs TDA8575 feature comparison

ISO102-BI Burr-Brown Corp

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TDA8575 NXP Semiconductors

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer BURR-BROWN CORP NXP SEMICONDUCTORS
Package Description DIP, DIP16/24,.6 DIP, DIP16,.3
Reach Compliance Code unknown unknown
Amplifier Type ISOLATION AMPLIFIER ISOLATION AMPLIFIER
Bandwidth (3dB)-Nom 0.07 MHz 20 MHz
Common Mode Voltage-Max 1500 V 1 V
Isolation Voltage-Min 1500 V
JESD-30 Code R-CDIP-T16 R-PDIP-T16
JESD-609 Code e0
Neg Supply Voltage Limit-Max -20 V
Neg Supply Voltage-Nom (Vsup) -15 V
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP16/24,.6 DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Supply Current-Max 33 mA 15 mA
Supply Voltage Limit-Max 20 V 18 V
Supply Voltage-Nom (Vsup) 15 V 8.5 V
Surface Mount NO NO
Technology BIPOLAR BIPOLAR
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 1 3
Part Package Code DIP
Pin Count 16
ECCN Code EAR99
HTS Code 8542.33.00.01
Length 21.6 mm
Seated Height-Max 4.7 mm
Voltage Gain-Max 0.5
Voltage Gain-Min -0.5
Width 7.62 mm

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