ISO130UB vs HCPL-7820OPTION300 feature comparison

ISO130UB Texas Instruments

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HCPL-7820OPTION300 Hewlett Packard Co

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer TEXAS INSTRUMENTS INC HEWLETT PACKARD CO
Part Package Code SOIC SOIC
Package Description SOP, GWDIP8,.4 SOP,
Pin Count 8 8
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.33.00.01 8542.33.00.01
Amplifier Type ISOLATION AMPLIFIER ISOLATION AMPLIFIER
Bandwidth (3dB)-Nom 0.085 MHz 200 MHz
Common Mode Voltage-Max 2.6 V 3750 V
Isolation Voltage-Min 3750 V 3750 V
JESD-30 Code R-PDSO-G8 R-PDSO-G8
Length 9.655 mm
Number of Functions 1 1
Number of Terminals 8 8
Operating Temperature-Max 85 °C 100 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code GWDIP8,.4
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.7 mm
Supply Current-Max 15.5 mA
Supply Voltage Limit-Max 5.5 V 5.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology HYBRID CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Voltage Gain-Max 8.01 8.4
Voltage Gain-Min 7.85 7.6
Width 6.35 mm
Base Number Matches 2 4

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