ISO174P
vs
HCPL-788J-000E
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
BURR-BROWN CORP
|
AVAGO TECHNOLOGIES INC
|
| Package Description |
DIP, DIP16/24,.6
|
SOP, SOP16,.4
|
| Reach Compliance Code |
unknown
|
compliant
|
| Amplifier Type |
ISOLATION AMPLIFIER
|
ISOLATION AMPLIFIER
|
| Bandwidth (3dB)-Nom |
10 MHz
|
0.03 MHz
|
| Common Mode Voltage-Max |
1500 V
|
|
| Isolation Voltage-Min |
1500 V
|
5000 V
|
| JESD-30 Code |
R-PDIP-T16
|
R-PDSO-G16
|
| JESD-609 Code |
e0
|
e3
|
| Neg Supply Voltage Limit-Max |
-18 V
|
|
| Neg Supply Voltage-Nom (Vsup) |
-15 V
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
SOP
|
| Package Equivalence Code |
DIP16/24,.6
|
SOP16,.4
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage Limit-Max |
18 V
|
5.5 V
|
| Supply Voltage-Nom (Vsup) |
15 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
BIPOLAR
|
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
MATTE TIN
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Part Package Code |
|
SOIC
|
| Pin Count |
|
16
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.33.00.01
|
| Samacsys Manufacturer |
|
Avago Technologies
|
| Length |
|
10.312 mm
|
| Moisture Sensitivity Level |
|
1
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Seated Height-Max |
|
3.911 mm
|
| Supply Current-Max |
|
40 mA
|
| Voltage Gain-Max |
|
8.3333
|
| Voltage Gain-Min |
|
7.5397
|
| Width |
|
7.5 mm
|
|
|
|
Compare ISO174P with alternatives
Compare HCPL-788J-000E with alternatives