ISP1102AW
vs
ISP1102AW,118
feature comparison
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
Part Package Code |
BCC
|
BCC
|
Package Description |
HVQCCN, LCC16,.12SQ,30/20
|
HVQCCN,
|
Pin Count |
16
|
16
|
Manufacturer Package Code |
SOT-639-2
|
SOT-639-2
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Differential Output |
YES
|
YES
|
Driver Number of Bits |
1
|
1
|
Input Characteristics |
DIFFERENTIAL SCHMITT TRIGGER
|
DIFFERENTIAL SCHMITT TRIGGER
|
Interface IC Type |
LINE TRANSCEIVER
|
LINE TRANSCEIVER
|
Interface Standard |
GENERAL PURPOSE
|
GENERAL PURPOSE
|
JESD-30 Code |
S-PQCC-N16
|
S-PQCC-N16
|
Length |
3 mm
|
3 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Out Swing-Min |
2.5 V
|
|
Output Low Current-Max |
0.002 A
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HVQCCN
|
HVQCCN
|
Package Equivalence Code |
LCC16,.12SQ,30/20
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Receive Delay-Max |
15 ns
|
15 ns
|
Receiver Number of Bits |
1
|
1
|
Seated Height-Max |
0.8 mm
|
0.8 mm
|
Supply Current-Max |
8 mA
|
|
Supply Voltage-Max |
3.6 V
|
3.6 V
|
Supply Voltage-Min |
1.65 V
|
1.65 V
|
Supply Voltage-Nom |
1.8 V
|
1.8 V
|
Supply Voltage1-Max |
5.5 V
|
5.5 V
|
Supply Voltage1-Min |
4 V
|
4 V
|
Supply Voltage1-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Transmit Delay-Max |
18 ns
|
18 ns
|
Width |
3 mm
|
3 mm
|
Base Number Matches |
3
|
1
|
|
|
|