ISP1302HN
vs
ISP1302HN,518
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Part Package Code |
QFN
|
QFN
|
| Package Description |
HVQCCN,
|
HVQCCN,
|
| Pin Count |
24
|
24
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Differential Output |
YES
|
YES
|
| Driver Number of Bits |
1
|
1
|
| Input Characteristics |
DIFFERENTIAL SCHMITT TRIGGER
|
DIFFERENTIAL SCHMITT TRIGGER
|
| Interface IC Type |
LINE TRANSCEIVER
|
LINE TRANSCEIVER
|
| Interface Standard |
GENERAL PURPOSE
|
GENERAL PURPOSE
|
| JESD-30 Code |
S-PQCC-N24
|
S-PQCC-N24
|
| Length |
4 mm
|
4 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
24
|
24
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
HVQCCN
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Receive Delay-Max |
15 ns
|
15 ns
|
| Receiver Number of Bits |
1
|
1
|
| Seated Height-Max |
1 mm
|
1 mm
|
| Supply Voltage-Max |
4.5 V
|
4.5 V
|
| Supply Voltage-Min |
3 V
|
3 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Supply Voltage1-Max |
3.6 V
|
3.6 V
|
| Supply Voltage1-Min |
1.4 V
|
1.4 V
|
| Supply Voltage1-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Transmit Delay-Max |
18 ns
|
18 ns
|
| Width |
4 mm
|
4 mm
|
| Base Number Matches |
4
|
1
|
|
|
|
Compare ISP1302HN with alternatives
Compare ISP1302HN,518 with alternatives