J310
vs
LM2575HVMX-5.0/NOPB
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
SILICONIX INC
|
NATIONAL SEMICONDUCTOR CORP
|
Part Package Code |
TO-92
|
|
Pin Count |
3
|
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
Samacsys Manufacturer |
Vishay
|
|
FET Technology |
JUNCTION
|
|
JESD-609 Code |
e0
|
e3
|
Operating Temperature-Max |
150 °C
|
125 °C
|
Polarity/Channel Type |
N-CHANNEL
|
|
Power Dissipation-Max (Abs) |
0.4 W
|
|
Surface Mount |
NO
|
YES
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
Matte Tin (Sn)
|
Base Number Matches |
1
|
1
|
Package Description |
|
SOIC-24
|
HTS Code |
|
8542.39.00.01
|
Additional Feature |
|
CAN ALSO CONFIGURED AS BUCK BOOST REGULATOR
|
Analog IC - Other Type |
|
SWITCHING REGULATOR
|
Control Mode |
|
VOLTAGE-MODE
|
Control Technique |
|
PULSE WIDTH MODULATION
|
Input Voltage-Max |
|
60 V
|
Input Voltage-Min |
|
8 V
|
Input Voltage-Nom |
|
12 V
|
JESD-30 Code |
|
R-PDSO-G24
|
Length |
|
15.4 mm
|
Moisture Sensitivity Level |
|
3
|
Number of Functions |
|
1
|
Number of Terminals |
|
24
|
Operating Temperature-Min |
|
-40 °C
|
Output Current-Max |
|
3.2 A
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Code |
|
SOP
|
Package Equivalence Code |
|
SOP24,.4
|
Package Shape |
|
RECTANGULAR
|
Package Style |
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
|
260
|
Qualification Status |
|
Not Qualified
|
Seated Height-Max |
|
2.65 mm
|
Switcher Configuration |
|
BUCK
|
Switching Frequency-Max |
|
63 kHz
|
Technology |
|
BIPOLAR
|
Temperature Grade |
|
AUTOMOTIVE
|
Terminal Form |
|
GULL WING
|
Terminal Pitch |
|
1.27 mm
|
Terminal Position |
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
|
40
|
Width |
|
7.5 mm
|
|
|
|
Compare J310 with alternatives
Compare LM2575HVMX-5.0/NOPB with alternatives