JAN2N3737UB vs JANTX2N3737UB feature comparison

JAN2N3737UB Microchip Technology Inc

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JANTX2N3737UB Microsemi Corporation

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Rohs Code No No
Part Life Cycle Code Active Transferred
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROSEMI CORP
Package Description CERAMIC PACKAGE-3 CERAMIC PACKAGE-3
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.80
Factory Lead Time 22 Weeks
Collector Current-Max (IC) 1.5 A 1.5 A
Collector-Emitter Voltage-Max 40 V 40 V
Configuration SINGLE SINGLE
DC Current Gain-Min (hFE) 20 20
JEDEC-95 Code TO-46 TO-46
JESD-30 Code R-CDSO-N3 R-CDSO-N3
JESD-609 Code e0 e0
Number of Elements 1 1
Number of Terminals 3 3
Operating Temperature-Max 200 °C 200 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Polarity/Channel Type NPN NPN
Qualification Status Qualified Not Qualified
Reference Standard MIL-19500/395 MIL-19500/395
Surface Mount YES YES
Terminal Finish TIN LEAD TIN LEAD
Terminal Form NO LEAD NO LEAD
Terminal Position DUAL DUAL
Transistor Application SWITCHING SWITCHING
Transistor Element Material SILICON SILICON
Turn-off Time-Max (toff) 60 ns 60 ns
Turn-on Time-Max (ton) 48 ns 48 ns
Base Number Matches 1 1
Pbfree Code No
Part Package Code SOT
Pin Count 3

Compare JAN2N3737UB with alternatives

Compare JANTX2N3737UB with alternatives