JANS1N937B-1
vs
1N937BE3
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
HERMETIC SEALED, GLASS PACKAGE-2
|
ROHS COMPLIANT, HERMETICALLY SEALED, GLASS, DO-7, 2 PIN
|
Reach Compliance Code |
compliant
|
compliant
|
Factory Lead Time |
39 Weeks
|
26 Weeks
|
Additional Feature |
METALLURGICALLY BONDED
|
METALLURGICAL BONDED
|
Case Connection |
ISOLATED
|
ISOLATED
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
ZENER DIODE
|
ZENER DIODE
|
JEDEC-95 Code |
DO-35
|
DO-204AA
|
JESD-30 Code |
O-LALF-W2
|
O-LALF-W2
|
JESD-609 Code |
e0
|
e3
|
Number of Elements |
1
|
1
|
Number of Terminals |
2
|
2
|
Package Body Material |
GLASS
|
GLASS
|
Package Shape |
ROUND
|
ROUND
|
Package Style |
LONG FORM
|
LONG FORM
|
Power Dissipation-Max |
0.5 W
|
0.5 W
|
Qualification Status |
Qualified
|
Not Qualified
|
Reference Standard |
MIL-19500
|
|
Reference Voltage-Nom |
9 V
|
9 V
|
Surface Mount |
NO
|
NO
|
Technology |
ZENER
|
ZENER
|
Terminal Finish |
TIN LEAD
|
MATTE TIN
|
Terminal Form |
WIRE
|
WIRE
|
Terminal Position |
AXIAL
|
AXIAL
|
Voltage Temp Coeff-Max |
0.18 mV/°C
|
0.18 mV/°C
|
Voltage Tol-Max |
5%
|
5%
|
Base Number Matches |
1
|
1
|
Dynamic Impedance-Max |
|
20 Ω
|
Operating Temperature-Max |
|
150 °C
|
Polarity |
|
UNIDIRECTIONAL
|
Working Test Current |
|
7.5 mA
|
|
|
|
Compare JANS1N937B-1 with alternatives
Compare 1N937BE3 with alternatives