JANTXV2N7224U
vs
SFF75N10MUB
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
MICROSEMI CORP
|
SOLID STATE DEVICES INC
|
Part Package Code |
TO-276AB
|
TO-254AA
|
Package Description |
SMD-1, U-PKG-3
|
FLANGE MOUNT, S-XSFM-P3
|
Pin Count |
3
|
3
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
Additional Feature |
HIGH RELIABILITY
|
|
Avalanche Energy Rating (Eas) |
150 mJ
|
2500 mJ
|
Case Connection |
DRAIN
|
|
Configuration |
SINGLE WITH BUILT-IN DIODE
|
SINGLE
|
DS Breakdown Voltage-Min |
100 V
|
100 V
|
Drain Current-Max (ID) |
34 A
|
56 A
|
Drain-source On Resistance-Max |
0.081 Ω
|
0.02 Ω
|
FET Technology |
METAL-OXIDE SEMICONDUCTOR
|
METAL-OXIDE SEMICONDUCTOR
|
JEDEC-95 Code |
TO-276AB
|
TO-254AA
|
JESD-30 Code |
R-XBCC-N3
|
S-XSFM-P3
|
JESD-609 Code |
e0
|
|
Number of Elements |
1
|
1
|
Number of Terminals |
3
|
3
|
Operating Mode |
ENHANCEMENT MODE
|
ENHANCEMENT MODE
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
CHIP CARRIER
|
FLANGE MOUNT
|
Polarity/Channel Type |
N-CHANNEL
|
N-CHANNEL
|
Pulsed Drain Current-Max (IDM) |
136 A
|
|
Qualification Status |
Qualified
|
Not Qualified
|
Reference Standard |
MIL-19500/592
|
|
Surface Mount |
YES
|
NO
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
NO LEAD
|
PIN/PEG
|
Terminal Position |
BOTTOM
|
SINGLE
|
Transistor Application |
SWITCHING
|
SWITCHING
|
Transistor Element Material |
SILICON
|
SILICON
|
Base Number Matches |
1
|
4
|
|
|
|
Compare JANTXV2N7224U with alternatives
Compare SFF75N10MUB with alternatives