JM38510/01701BEC vs M38510/01701BEX feature comparison

JM38510/01701BEC NXP Semiconductors

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M38510/01701BEX NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SIGNETICS CORP NXP SEMICONDUCTORS
Package Description , DIP,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family TTL/H/L TTL/H/L
JESD-30 Code R-GDIP-T16 R-GDIP-T16
Load Capacitance (CL) 15 pF
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Number of Bits 6 6
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Output Polarity TRUE TRUE
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Power Supply Current-Max (ICC) 65 mA
Propagation Delay (tpd) 30 ns 43 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology TTL TTL
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
fmax-Min 25 MHz 25 MHz
Base Number Matches 3 6
Part Package Code DIP
Pin Count 16
Screening Level MIL-PRF-38535 Class B
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V

Compare JM38510/01701BEC with alternatives

Compare M38510/01701BEX with alternatives