JM38510/05003BCA vs MC14023UBCL feature comparison

JM38510/05003BCA Intersil Corporation

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MC14023UBCL onsemi

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer HARRIS SEMICONDUCTOR ON SEMICONDUCTOR
Package Description , DIP, DIP14,.3
Reach Compliance Code unknown not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-GDIP-T14 R-CDIP-T14
Logic IC Type NAND GATE NAND GATE
Number of Functions 3 3
Number of Inputs 3 3
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 12 V 18 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 4 4
Rohs Code No
JESD-609 Code e0
Length 19.495 mm
Load Capacitance (CL) 50 pF
Package Equivalence Code DIP14,.3
Prop. Delay@Nom-Sup 180 ns
Propagation Delay (tpd) 180 ns
Schmitt Trigger NO
Seated Height-Max 5.08 mm
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Pitch 2.54 mm
Width 7.62 mm

Compare JM38510/05003BCA with alternatives

Compare MC14023UBCL with alternatives