JM38510/05151BCA vs HEC4013BDB feature comparison

JM38510/05151BCA National Semiconductor Corporation

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HEC4013BDB NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP NXP SEMICONDUCTORS
Package Description DIP-14 DIP,
Reach Compliance Code unknown unknown
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-CDIP-T14 R-GDIP-T14
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Number of Bits 1 1
Number of Functions 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 300 ns 220 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 18 V 15 V
Supply Voltage-Min (Vsup) 3 V 3 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
fmax-Min 3.5 MHz 7 MHz
Base Number Matches 5 1
Part Package Code DIP
Pin Count 14
HTS Code 8542.39.00.01
Load Capacitance (CL) 50 pF
Seated Height-Max 5.08 mm
Supply Voltage-Nom (Vsup) 5 V
Terminal Pitch 2.54 mm
Width 7.62 mm

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