JM38510/30005BDC vs SN74LS10NS feature comparison

JM38510/30005BDC Philips Semiconductors

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SN74LS10NS Motorola Semiconductor Products

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SIGNETICS CORP MOTOROLA INC
Package Description , PLASTIC, DIP-14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family LS LS
JESD-30 Code R-CDFP-F14 R-PDIP-T14
Load Capacitance (CL) 15 pF
Logic IC Type NAND GATE NAND GATE
Number of Functions 3 3
Number of Inputs 3 3
Number of Terminals 14 14
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code DFP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK IN-LINE
Power Supply Current-Max (ICC) 3.3 mA
Propagation Delay (tpd) 15 ns 15 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.25 V
Supply Voltage-Min (Vsup) 4.5 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology TTL TTL
Temperature Grade MILITARY COMMERCIAL
Terminal Form FLAT THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 1 1
Rohs Code No
JESD-609 Code e0
Length 18.86 mm
Package Equivalence Code DIP14,.3
Schmitt Trigger NO
Seated Height-Max 5.08 mm
Terminal Finish TIN LEAD
Terminal Pitch 2.54 mm
Width 7.62 mm

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