JM38510/37001BCA vs N74ALS00AN feature comparison

JM38510/37001BCA Texas Instruments

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N74ALS00AN NXP Semiconductors

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Pbfree Code Yes
Rohs Code No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC NXP SEMICONDUCTORS
Part Package Code DIP
Package Description DIP, DIP,
Pin Count 14
Reach Compliance Code not_compliant unknown
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Family ALS ALS
JESD-30 Code R-PDIP-T14 R-PDIP-T14
JESD-609 Code e0
Length 19.45 mm 19.025 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.0004 A
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Packing Method TUBE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Power Supply Current-Max (ICC) 17.4 mA 3 mA
Prop. Delay@Nom-Sup 5 ns
Propagation Delay (tpd) 15 ns 8 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO
Screening Level MIL-M-38510 Class B
Seated Height-Max 5.08 mm 4.2 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology TTL TTL
Temperature Grade MILITARY COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm 7.62 mm
Base Number Matches 1 1

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Compare N74ALS00AN with alternatives