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JM38510/65001BCA vs 74HC00N,652 feature comparison

JM38510/65001BCA Texas Instruments

Buy Now Datasheet

74HC00N,652 NXP Semiconductors

Buy Now Datasheet
Part Life Cycle Code Active Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC NXP SEMICONDUCTORS
Part Package Code DIP DIP
Package Description DIP, DIP, DIP14,.3
Pin Count 14 14
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature LG-MAX
Family HC/UH HC/UH
JESD-30 Code R-GDIP-T14 R-PDIP-T14
Length 19.56 mm 19.025 mm
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.0052 A 0.004 A
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Packing Method TUBE BULK PACK
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Propagation Delay (tpd) 135 ns 135 ns
Qualification Status Not Qualified Not Qualified
Screening Level MIL-M-38510 Class B
Seated Height-Max 5.08 mm 4.2 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY AUTOMOTIVE
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Width 6.67 mm 7.62 mm
Base Number Matches 1 1
Rohs Code Yes
Manufacturer Package Code SOT27-1
Load Capacitance (CL) 50 pF
Package Equivalence Code DIP14,.3
Power Supplies 2/6 V
Prop. Delay@Nom-Sup 27 ns
Schmitt Trigger NO
Terminal Finish NICKEL/PALLADIUM/GOLD (NI/PD/AU)

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Compare 74HC00N,652 with alternatives

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