JM38510/65001BCA vs MC74HC03AF feature comparison

JM38510/65001BCA National Semiconductor Corporation

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MC74HC03AF onsemi

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP ON SEMICONDUCTOR
Package Description CERAMIC, DIP-14 SSOP,
Reach Compliance Code unknown compliant
Family HC/UH HC/UH
JESD-30 Code R-GDIP-T14 R-PDSO-G14
JESD-609 Code e0 e4
Length 19.45 mm 6.2 mm
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP SSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED
Propagation Delay (tpd) 135 ns 180 ns
Qualification Status Not Qualified Not Qualified
Screening Level MIL-M-38510 Class B
Seated Height-Max 5.08 mm 2 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 3 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm 5.3 mm
Base Number Matches 3 1
Rohs Code Yes
Part Package Code SOIC
Pin Count 14
HTS Code 8542.39.00.01
Output Characteristics OPEN-DRAIN

Compare JM38510/65001BCA with alternatives

Compare MC74HC03AF with alternatives