JM38510/65001BCA
vs
SN54HC00J
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
TEXAS INSTRUMENTS INC
ROCHESTER ELECTRONICS LLC
Part Package Code
DIP
DIP
Pin Count
14
14
Reach Compliance Code
not_compliant
unknown
ECCN Code
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
LG-MAX
LG-MAX
Family
HC/UH
HC/UH
JESD-30 Code
R-GDIP-T14
R-GDIP-T14
JESD-609 Code
e0
Length
19.94 mm
19.94 mm
Load Capacitance (CL)
50 pF
Logic IC Type
NAND GATE
NAND GATE
Max I(ol)
0.0052 A
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP14,.3
DIP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Packing Method
TUBE
Power Supply Current-Max (ICC)
0.04 mA
Prop. Delay@Nom-Sup
27 ns
Propagation Delay (tpd)
135 ns
135 ns
Qualification Status
Not Qualified
Schmitt Trigger
NO
Screening Level
MIL-M-38510 Class B
Seated Height-Max
5.08 mm
5.08 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Base Number Matches
3
2
Package Description
HERMETIC SEALED, CERAMIC, DIP-14
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare JM38510/65001BCA with alternatives
Compare SN54HC00J with alternatives