JM38510/65001BCA
vs
TC74HC00APF
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
TOSHIBA CORP
Package Description
CERAMIC, DIP-14
0.300 INCH, 2.54 MM PITCH, LEAD FREE, PLASTIC, DIP-14
Reach Compliance Code
unknown
compliant
Family
HC/UH
HC/UH
JESD-30 Code
R-GDIP-T14
R-PDIP-T14
JESD-609 Code
e0
Length
19.45 mm
19.25 mm
Logic IC Type
NAND GATE
NAND GATE
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP14,.3
DIP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
NOT SPECIFIED
Propagation Delay (tpd)
135 ns
95 ns
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-M-38510 Class B
Seated Height-Max
5.08 mm
4.45 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
4.5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
NOT SPECIFIED
Width
7.62 mm
7.62 mm
Base Number Matches
3
1
Pbfree Code
Rohs Code
Part Package Code
DIP
Pin Count
14
HTS Code
8542.39.00.01
Samacsys Manufacturer
Toshiba
Load Capacitance (CL)
50 pF
Max I(ol)
0.004 A
Packing Method
TUBE
Prop. Delay@Nom-Sup
19 ns
Schmitt Trigger
NO
Compare JM38510/65001BCA with alternatives
Compare TC74HC00APF with alternatives